400 Tie Points Contacts Mini Circuit Experiment Solderless Breadboard

The 400 Tie Points Contacts Mini Circuit Experiment Solderless Breadboard is a versatile breadboard for prototyping electronic circuits. It features 400 tie points, including 2 power buses, 30 columns, and 10 rows. The breadboard is reusable and does not require soldering, making it easy to modify or revise circuits.

  Features:  

• 400 tie points, including 2 power buses
• Perfect for Arduino shield prototyping and testing
• Plastic housing with metal contact clips
• Accepts wire sizes in the range of 20-29AWG
• Adhesive sheet on the backside for easy mounting
• Can be spliced together with multiple breadboard

  Specifications:  

• Cable Size (AWG): 20 - 29
• Maximum Voltage (V): 300
• Maximum Current (A): 3 - 5
• Length (mm): 82
• Width (mm): 55
• Height (mm): 10
• Weight (gm): 40

  Package Includes:  

• 1 x 400 Tie Points Solderless Breadboard